Our 4-inch silicon foundry is specifically geared toward R&D and prototyping with small lot runs (from single wafer up to 1000+ wafers per year). We offer the following services for substrates up to 4-inch diameter and thickness up to 3 mm (single or double sided processing):
- Thermal Oxidation (wet or dry up to 1250 degC)
- Diffusion (up to 1250 degC)
- Liquid source doping and gettering (BBr3 and POCl3)
- Photolithography – double sided with 5 micron resolution
- Wet processing – RCA and Piranha cleans and various acid and decorative etches
- Aluminum metal deposition (e-beam) up to 25 microns thick
- Wafer dicing up to 6-inch diameter
- Metrology services – including:
- Film thickness measurements
- Four Point Probe
- Minority carrier and iron contamination mapping
- Surface particle contamination count
- Electrical characterization (I-V)
In addition to those services listed above, OTC can offer countless more options through the use of our fully qualified vendors.
To request more information, please Click Here, fill out our inquiry form, and a representative will contact you promptly.
